We have an electronic / automotive (dashboard) product that is about
to be released, and the first production run will consist of
hand-built units. In order to solidify and encapsulate everything, we
would like to be able to coat the constructed circuitry with a thick
layer of what is commonly referred to as potting compound.
We also regularly stock cold weld/epoxy compounds, but these are far
too expensive to coat an entire circuitboard in a thick layer.
My question is: Does an appropriate, inexpensive and available
"filler" exist that would mix properly with cold welds or epoxies to
effectively create an electrically insulative coating for circuitry?
If so: what is it, where can I obtain some, what particular brand(s)
of epoxy or cold weld would work best with it, and what percentages of
each component (steel/hardner/filler, for example) would be
appropriate for an optimum mix? Also, what ranges of mix percentages
would be considered acceptable?
We are open to, and in fact hoping for, a "filler" solution that is
made of some readily-available and obtainable substance, such as dirt
-- or ash, or something similar.
If not: Please help me locate a source for the materials and supplies
I would need for the industry-standard potting process (or a
less-expensive alternative that I had not yet considered would be
acceptable as well). |